深圳pcb制板-高TG主板

Release time：2019-03-29 Editor author：Jin Zhi Zhu Read：9133

特點：深圳pcb制板該項目需壓接工藝，對壓接孔徑公差要求嚴格，公差+/-0.05mm

層數(shù)：12 層

板材：高TG FR4

板厚：2.0mm

單板大?。?92X249.6mm

表面處理工藝：沉金

銅厚：1OZ（其中內(nèi)層銅厚需陰陽銅配對）

線寬/線距：4/4mil

孔徑：0.2mm

阻抗控制：10% 油墨 深圳pcb制板

Previous：PCB制板-高TG半孔板

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Title: Temperature Detection Method for Temperature Control Switches web：http://besttoolbackpack.com/news/12.html

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